Expert Groups
Based on initially identified COREnect end-to-end system view together with value chain consideration, COREnect organizes three COREnect Expert Groups to address industry roadmaps in three strategic focus areas
· Expert Group #1 Compute & Store
· Expert Group #2 Connect & Communicate
· Expert Group #3 Sense & Power
Security and energy efficiency are cross-cut design considerations in the COREnect technical vision and inherently the work of Expert Groups.
As a result of one workshop and several internal meetings, the consortium-internal and external experts from industry, research institutes, universities, and European associations aligned their views on Europe’s major challenges and opportunities. Combining their specialist knowledge, COREnect benefits from broad insights into crucial fields that require our attention and, thus, address the upcoming challenges in Europe regarding 5G and beyond. Altogether, capturing and crystallizing the discussions, the three Expert Groups will cooperatively develop the COREnect industry roadmap in the first half-year of 2021.
Prof. Dr. Gerhard Fettweis, TU Dresden Vodafone Chair Professor and CEO of Barkhausen Institute and Dipl-Ing
Viktor Razilov, Research Staff at TU Dresden Vodafone Chair
EG1
Regarding the initial idea for the COREnect industry roadmap, Expert Group 1 (EG1) identifies open challenges for innovations in the area of digital computing chips that would ensure European technological sovereignty. Since controlling every component may not be realistic, the focus lies on how to keep checks and balances. As an initial result, the EG identified challenges regarding KPIs, instruction set architecture, storage, multiprocessor system on a chip, operating systems as well as system architecture.
EG2
Expert Group 2 (EG2) investigates how Europe can establish leadership and sovereignty in communications and sensing. This domain is subject to an insatiable demand of ever-increasing data rates, leading to ever-growing challenges on the technological side. Within EG2, the main focus is set on data center infrastructure for cloud-centric applications, wireless infrastructure, industrial-grade connectivity, and consumer-grade connectivity. Initial outputs are gap analyses for each focus area, e.g., covering hardware design in very advanced CMOS, availability of and access to advanced CMOS processes, and silicon photonics technologies. Further, the aspect of sovereignty on CAD software is highlighted next to non-technical gaps that hinder advancements on the telecommunication side.
Piet Wambacq, imec Fellow of Technical Staff and Professor at Vrije Universiteit Brussel
Björn Debaillie, Program Manager Collaborative R&D at imec
Didier Belot, System to Technology Transverse Programs Manager at CEA
Frederic Gianesello, RF Funding Coordinator at ST Microelectronics
Jochen Koszescha, Funding Projects Coordinator at Infineon Technologies
Marina Plietsch, R&D Funding Assistance at Infineon Technologies
Patrick Pype, Director of Strategic Partnerships & External Relations at NXP
Manuela Neyer, Funding Projects & Coordination at Infineon Technologies
EG3
Expert Group 3 (EG3) will contribute with a focus on supplementary core technologies that support the design of computing components (EG1) and communication technologies (EG2). The Peripheral technologies - as essentials for controlling the telecommunication and vertical value chain - were scrutinized, with key challenges identified and further investigated as initial results. Technology and application requirements, as well as access to manufacturing and strategic choices of Europe in the value chain were considered, resulting in the three focus areas: core process technologies for addressing the needs of Europe, system and component architectures as well as power management and energy efficiency on device and system level.
With continuous exchange internally and between the Expert Groups, the industry roadmap will develop a holistic approach by examining electronics for reliable communication, future core-technologies and integration, and energy-efficient communication electronics from different viewpoints. Thus, the initial COREnect industry roadmap will build synergies and paves the way towards Europe’s strongholds and opportunities.